ic
TJA1057GTK/3Z
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| TXD | output | SMD | roundrect | 0.356×0.711 | |
| GND | ground | SMD | roundrect | 0.356×0.711 | |
| VCC | power | SMD | roundrect | 0.356×0.711 | |
| RXD | input | SMD | roundrect | 0.356×0.711 | |
| VIO | passive | SMD | roundrect | 0.356×0.711 | |
| CANL | passive | SMD | roundrect | 0.356×0.711 | |
| CANH | passive | SMD | roundrect | 0.356×0.711 | |
| S | passive | SMD | roundrect | 0.356×0.711 | |
| GND | ground | SMD | roundrect | 2.4×1.6 |
Save parts to a list and design PCBs from them
Details
- Category
- ic
- MPN
- TJA1057GTK/3Z
- Manufacturer
- NXP Semicon
- Package
- HVSON-8-EP(3x3)
- Footprint
- HVSON-8_L3.0-W3.0-P0.65-BL-EP
- JLCPCB
- C459823
- LCSC
- C459823
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(188 pcs)
1-29 pcs$1.1792
30-89 pcs$0.9671
90-299 pcs$0.8514
300-1499 pcs$0.7197
1500-2999 pcs$0.6603
3000+ pcs$0.6346