ic
TEA2017AAT
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SNSMAINS | input | SMD | oval | 0.574×2.038 | |
| SNSBOOST | output | SMD | oval | 0.574×2.038 | |
| SNSCURPFC | io | SMD | oval | 0.574×2.038 | |
| GND | ground | SMD | oval | 0.574×2.038 | |
| GATEPFC | passive | SMD | oval | 0.574×2.038 | |
| GATELS | passive | SMD | oval | 0.574×2.038 | |
| HVS | passive | SMD | oval | 0.574×2.038 | |
| DRAINPFC | passive | SMD | oval | 0.574×2.038 | |
| GATEHS | passive | SMD | oval | 0.574×2.038 | |
| SUPHS | passive | SMD | oval | 0.574×2.038 | |
| HB | passive | SMD | oval | 0.574×2.038 | |
| HVS | passive | SMD | oval | 0.574×2.038 | |
| SUPIC | passive | SMD | oval | 0.574×2.038 | |
| SNSCAP(SDA) | passive | SMD | oval | 0.574×2.038 | |
| SNSCURLLC(SCL) | passive | SMD | oval | 0.574×2.038 | |
| SNSFB | passive | SMD | oval | 0.574×2.038 |
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Details
- Category
- ic
- MPN
- TEA2017AAT
- Manufacturer
- NXP Semicon
- Package
- SO-16
- Footprint
- SO-16_L9.9-W3.9-P1.27-LS6.0-BL
- JLCPCB
- C4748838
- LCSC
- C4748838
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- -
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-99 pcs$0.0392
100+ pcs$0.0202