ic
SY89851UMG-TR
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| IN | input | SMD | roundrect | 0.28×0.8 | |
| VT | output | SMD | roundrect | 0.28×0.8 | |
| VREF-AC | io | SMD | roundrect | 0.28×0.8 | |
| /IN | passive | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| Q1 | passive | SMD | roundrect | 0.28×0.8 | |
| /Q1 | passive | SMD | roundrect | 0.28×0.8 | |
| /Q0 | passive | SMD | roundrect | 0.28×0.8 | |
| Q0 | passive | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| EP | passive | SMD | roundrect | 1.6×1.6 |
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Details
- Category
- ic
- MPN
- SY89851UMG-TR
- Manufacturer
- Microchip Technology
- Package
- TQFN-16-EP(3x3)
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-TL-EP1.6
- JLCPCB
- C632511
- LCSC
- C632511
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$2.2169
10-29 pcs$1.8796
30-99 pcs$1.6675
100-499 pcs$1.4506
500-999 pcs$1.3527
1000+ pcs$1.3109