ic
MIC2131-4YTSE
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| AVDD | power | SMD | roundrect | 0.343×1.56 | |
| PGOOD | passive | SMD | roundrect | 0.343×1.56 | |
| HCL/AGND2 | passive | SMD | roundrect | 0.343×1.56 | |
| SS | input | SMD | roundrect | 0.343×1.56 | |
| FB | input | SMD | roundrect | 0.343×1.56 | |
| COMP | passive | SMD | roundrect | 0.343×1.56 | |
| AGND1 | passive | SMD | roundrect | 0.343×1.56 | |
| EN/UVLO | input | SMD | roundrect | 0.343×1.56 | |
| VIN | input | SMD | roundrect | 0.343×1.56 | |
| VDD | power | SMD | roundrect | 0.343×1.56 | |
| LSD | passive | SMD | roundrect | 0.343×1.56 | |
| PGND | ground | SMD | roundrect | 0.343×1.56 | |
| SW | output | SMD | roundrect | 0.343×1.56 | |
| HSD | passive | SMD | roundrect | 0.343×1.56 | |
| BST | output | SMD | roundrect | 0.343×1.56 | |
| CS | input | SMD | roundrect | 0.343×1.56 | |
| EP | passive | SMD | roundrect | 2.4×2.3 |
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Details
- Category
- ic
- MPN
- MIC2131-4YTSE
- Manufacturer
- Microchip Technology
- Package
- ETSSOP-16-EP
- Footprint
- ETSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-EP
- JLCPCB
- C637635
- LCSC
- C637635
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$2.1880
10-29 pcs$1.8555
30-99 pcs$1.6482
100-499 pcs$1.4362
500-999 pcs$1.3398
1000+ pcs$1.2980