ic
MCP669T-E/ML
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VINA- | input | SMD | roundrect | 0.35×1 | |
| VINA+ | output | SMD | roundrect | 0.35×1 | |
| VDD | power | SMD | roundrect | 0.35×1 | |
| VINB+ | passive | SMD | roundrect | 0.35×1 | |
| VINB- | passive | SMD | roundrect | 1×0.35 | |
| VOUTB | output | SMD | roundrect | 1×0.35 | |
| CSBC# | passive | SMD | roundrect | 1×0.35 | |
| VOUTC | output | SMD | roundrect | 1×0.35 | |
| VINC- | passive | SMD | roundrect | 0.35×1 | |
| VINC+ | passive | SMD | roundrect | 0.35×1 | |
| VSS | ground | SMD | roundrect | 0.35×1 | |
| VIND+ | passive | SMD | roundrect | 0.35×1 | |
| VIND- | passive | SMD | roundrect | 1×0.35 | |
| VOUTD | output | SMD | roundrect | 1×0.35 | |
| CSAD# | passive | SMD | roundrect | 1×0.35 | |
| VOUTA | output | SMD | roundrect | 1×0.35 | |
| EP | passive | SMD | roundrect | 2.7×2.7 |
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Details
- Category
- ic
- MPN
- MCP669T-E/ML
- Manufacturer
- Microchip Technology
- Package
- QFN-16-EP(4x4)
- Footprint
- QFN-16_L4.0-W4.0-P0.65-BL-EP2.7-1
- JLCPCB
- C623762
- LCSC
- C623762
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
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1-9 pcs$2.2647
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500-999 pcs$0.8463
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