ic
MCP6482T-E/MNY
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VOUT A | output | SMD | rect | 0.75×0.3 | |
| VIN A- | input | SMD | rect | 0.75×0.3 | |
| VIN A+ | input | SMD | rect | 0.75×0.3 | |
| VSS | ground | SMD | rect | 0.75×0.3 | |
| VIN B+ | input | SMD | rect | 0.75×0.3 | |
| VIN B- | input | SMD | rect | 0.75×0.3 | |
| VOUT B | output | SMD | rect | 0.75×0.3 | |
| VDD | power | SMD | rect | 0.75×0.3 | |
| EP | passive | SMD | rect | 1.6×1.6 |
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Details
- Category
- ic
- MPN
- MCP6482T-E/MNY
- Manufacturer
- Microchip Technology
- Package
- TDFN-8-EP(2x3)
- Footprint
- TDFN-8_L3.0-W2.0-P0.50-BL-EP1.6
- JLCPCB
- C623733
- LCSC
- C623733
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.7312
10-29 pcs$1.4684
30-99 pcs$1.3040
100-499 pcs$1.1364
500-999 pcs$1.0606
1000+ pcs$1.0284