ic
MCP6024T-E/STV07
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VOUTA | output | SMD | rect | 0.4×1.7 | |
| VINA- | passive | SMD | rect | 0.4×1.7 | |
| VINA+ | passive | SMD | rect | 0.4×1.7 | |
| VDD | power | SMD | rect | 0.4×1.7 | |
| VINB+ | passive | SMD | rect | 0.4×1.7 | |
| VINB- | passive | SMD | rect | 0.4×1.7 | |
| VOUTB | output | SMD | rect | 0.4×1.7 | |
| VOUTC | output | SMD | rect | 0.4×1.7 | |
| VINC- | passive | SMD | rect | 0.4×1.7 | |
| VINC+ | passive | SMD | rect | 0.4×1.7 | |
| VSS | ground | SMD | rect | 0.4×1.7 | |
| VIND+ | passive | SMD | rect | 0.4×1.7 | |
| VIND- | passive | SMD | rect | 0.4×1.7 | |
| VOUTD | output | SMD | rect | 0.4×1.7 |
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Details
- Category
- ic
- MPN
- MCP6024T-E/STV07
- Manufacturer
- Microchip Technology
- Package
- TSSOP-14
- Footprint
- TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL
- JLCPCB
- C3012361
- LCSC
- C3012361
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- -
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