ic
MAX16833BAUE+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| LFRAMP(REF) | input | SMD | roundrect | 1.803×0.406 | |
| RT/SYNC | output | SMD | roundrect | 1.803×0.406 | |
| SGND | ground | SMD | roundrect | 1.803×0.406 | |
| ICTRL | passive | SMD | roundrect | 1.803×0.406 | |
| COMP | passive | SMD | roundrect | 1.803×0.406 | |
| FLT# | passive | SMD | roundrect | 1.803×0.406 | |
| PWMDIM | passive | SMD | roundrect | 1.803×0.406 | |
| OVP | passive | SMD | roundrect | 1.803×0.406 | |
| DIMOUT# | passive | SMD | roundrect | 1.803×0.406 | |
| ISENSE- | passive | SMD | roundrect | 1.803×0.406 | |
| ISENSE+ | passive | SMD | roundrect | 1.803×0.406 | |
| CS | input | SMD | roundrect | 1.803×0.406 | |
| PGND | ground | SMD | roundrect | 1.803×0.406 | |
| NDRV | passive | SMD | roundrect | 1.803×0.406 | |
| VCC | power | SMD | roundrect | 1.803×0.406 | |
| IN | passive | SMD | roundrect | 1.803×0.406 | |
| EP | passive | SMD | roundrect | 3×3 |
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Details
- Category
- ic
- MPN
- MAX16833BAUE+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TSSOP-16-EP
- Footprint
- TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-EP3.0
- JLCPCB
- C1554214
- LCSC
- C1554214
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(5 pcs)
1-9 pcs$16.0497
10-11 pcs$15.7204
12-13 pcs$15.7204
14-15 pcs$15.7204
16-17 pcs$15.7204
18+ pcs$15.7204