ic
BU8872FS-E2
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| INPUT | input | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| OSCOUT | io | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| OSCIN | passive | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| GND | ground | SMD | oval | 0.448×1.199 | |
| SD | passive | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| ACK | passive | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| EST | passive | SMD | oval | 0.448×1.199 | |
| NC | nc | SMD | oval | 0.448×1.199 | |
| VCC | power | SMD | oval | 0.448×1.199 |
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Details
- Category
- ic
- MPN
- BU8872FS-E2
- Manufacturer
- ROHM Semicon
- Package
- LSOP-16-175mil
- Footprint
- SSOP-A16_L6.6-W4.4-P0.80-LS6.2-BL
- JLCPCB
- C7091923
- LCSC
- C7091923
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.5261
10-11 pcs$1.5261
12-199 pcs$1.5261
200-499 pcs$0.6089
500-999 pcs$0.5896
1000+ pcs$0.5784