ic
BU2362FV-E2
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VDD2 | input | SMD | roundrect | 0.32×1 | |
| VSS2 | output | SMD | roundrect | 0.32×1 | |
| CLK27M | io | SMD | roundrect | 0.32×1 | |
| TEST | passive | SMD | roundrect | 0.32×1 | |
| AVDD | power | SMD | roundrect | 0.32×1 | |
| AVSS | ground | SMD | roundrect | 0.32×1 | |
| XTALOUT | passive | SMD | roundrect | 0.32×1 | |
| XTALIN | passive | SMD | roundrect | 0.32×1 | |
| CLKA | passive | SMD | roundrect | 0.32×1 | |
| CLK512FS | passive | SMD | roundrect | 0.32×1 | |
| DVSS | ground | SMD | roundrect | 0.32×1 | |
| DVDD | power | SMD | roundrect | 0.32×1 | |
| CLK16M | passive | SMD | roundrect | 0.32×1 | |
| FSEL1 | passive | SMD | roundrect | 0.32×1 | |
| CLK33M | passive | SMD | roundrect | 0.32×1 | |
| CLK36M | passive | SMD | roundrect | 0.32×1 |
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Details
- Category
- ic
- MPN
- BU2362FV-E2
- Manufacturer
- ROHM Semicon
- Package
- SSOP-16-4.4mm
- Footprint
- SSOP-16_L5.4-W4.4-P0.65-LS6.4-BL
- JLCPCB
- C2667762
- LCSC
- C2667762
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$4.0354
10-11 pcs$4.0354
12-199 pcs$4.0354
200-499 pcs$1.5631
500-999 pcs$1.5069
1000+ pcs$1.4796