ic
BGA3022518
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| AMPA_IN | input | SMD | oval | 0.63×1.865 | |
| TMP_SENS | output | SMD | oval | 0.63×1.865 | |
| CTRL | io | SMD | oval | 0.63×1.865 | |
| AMPB_IN | passive | SMD | oval | 0.63×1.865 | |
| AMPB_OUT | passive | SMD | oval | 0.63×1.865 | |
| VCC | power | SMD | oval | 0.63×1.865 | |
| VCC | power | SMD | oval | 0.63×1.865 | |
| AMPA_OUT | passive | SMD | oval | 0.63×1.865 | |
| GND | ground | SMD | roundrect | 3.3×2.4 |
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Details
- Category
- ic
- MPN
- BGA3022518
- Manufacturer
- NXP Semicon
- Package
- SOIC-8
- Footprint
- ESOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-1
- JLCPCB
- C3190969
- LCSC
- C3190969
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$6.6297
10-11 pcs$6.6297
12-199 pcs$6.6297
200-499 pcs$2.5655
500-999 pcs$2.4755
1000+ pcs$2.4322