ic
BGA 715N7 E6327
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| AI | input | SMD | roundrect | 0.3×0.4 | |
| BIAS | output | SMD | roundrect | 0.3×0.4 | |
| GND | ground | SMD | roundrect | 0.3×0.4 | |
| PON | passive | SMD | roundrect | 0.3×0.4 | |
| VCC | power | SMD | roundrect | 0.3×0.4 | |
| AO | passive | SMD | roundrect | 0.3×0.4 | |
| VSS | ground | SMD | roundrect | 1.15×1.1 |
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Details
- Category
- ic
- MPN
- BGA 715N7 E6327
- Manufacturer
- Infineon Technologies
- Package
- DFN-7(1.3x2)
- Footprint
- TSNP-7_L2.0-W1.4-P0.50-LS2.0-TL-EP
- JLCPCB
- C534167
- LCSC
- C534167
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(56 pcs)
1-9 pcs$0.4498
10-29 pcs$0.4402
30-99 pcs$0.4322
100-101 pcs$0.4257
102-103 pcs$0.4257
104+ pcs$0.4257