sensor
ICG-20330
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VDDIO | power | SMD | roundrect | 0.28×0.6 | |
| 2 | output | SMD | roundrect | 0.28×0.6 | |
| SCL/SPC | output | SMD | roundrect | 0.28×0.6 | |
| SDA/SDI | io | SMD | roundrect | 0.28×0.6 | |
| SA0/SDO | passive | SMD | roundrect | 0.28×0.6 | |
| CS | input | SMD | roundrect | 0.28×0.6 | |
| INT | passive | SMD | roundrect | 0.6×0.28 | |
| RESV | passive | SMD | roundrect | 0.6×0.28 | |
| FSYNC | passive | SMD | roundrect | 0.6×0.28 | |
| NC | nc | SMD | roundrect | 0.28×0.6 | |
| NC | nc | SMD | roundrect | 0.28×0.6 | |
| NC | nc | SMD | roundrect | 0.28×0.6 | |
| NC | nc | SMD | roundrect | 0.28×0.6 | |
| GND | ground | SMD | roundrect | 0.28×0.6 | |
| REGOUT | passive | SMD | roundrect | 0.6×0.28 | |
| RESV | passive | SMD | roundrect | 0.6×0.28 | |
| VDD | power | SMD | roundrect | 0.6×0.28 |
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Details
- Category
- sensor
- MPN
- ICG-20330
- Manufacturer
- TDK InvenSense
- Package
- LGA-16(3x3)
- Footprint
- LGA-16_L3.0-W3.0-P0.50-BL
- JLCPCB
- C2655094
- LCSC
- C2655094
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$5.3510
10-11 pcs$5.3510
12-199 pcs$5.3510
200-499 pcs$2.0723
500-999 pcs$1.9984
1000+ pcs$1.9631